Butyl Rubber Adhesive Moulding Compound

The molding compound (putty) is a cold applied, flexible, non hardening compound that is designed to fill gaps and irregular contour prior to the application of XUNDA butyl tape & bitumen tape. Product Composition The molding compound is formulated with inert organic...

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Product Details

System  Description


Butyl Rubber Adhesive Moulding Compound is a cold applied, flexible, non hardening compound that is designed to fill gaps and irregular contour prior to the application of XUNDA butyl tape & bitumen tape.


Product  Composition


The molding compound is formulated with inert organic fillers in a saturated hydrocarbon polymer base.


Product  Features


Easily applied with no special equipment

Conformable for easy applications over irregular surfaces 

Flexibility over a wide temperature range and under various conditions.


Product  Properties


Property

Test Method

Typical Value

Color


Black

Non volatile content


100%

Cone Penetration

ASTM D937

150d.mm

Adhesion to concrete , steel


Excellent

Resistance to Acids ,Alkalis and Salts


Excellent

Resistance to Microbiological attack


Excellent

Temperature Range
For Application For Service


0℃-50℃ 

-20℃-80℃


Ordering Information


Xunda molding compound are available in drums .


Product Type

Standard Ordering Options

Paste Color

Black or others

Paste Weight per Carton box

8 kg

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